Icepak

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Key Applications

Ansys Icepak is used to evaluate the thermal management of electronic systems in a wide range of applications, including simulation of air flow in enclosures, analysis of temperature distributions in chip and board-level packages, and detailed thermal modeling of complex systems such as telecommunications equipment and consumer electronics.

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IC package

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PCB

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Computer housing

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Smartphone biocompatibility

Related Information

Ansys Icepak – Brochure/strong>

https://www.ansys.com/-/media/ansys/corporate/resourcelibrary/brochure/ansys-icepak-19-brochure.pdf

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Staying Cool with Ansys Icepak

https://www.ansys.com/-/media/ansys/corporate/resourcelibrary/article/aa-v3-i2-staying-cool-with-ansys-icepak.pdf

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Predicting Circuit Board Hot Spots with Electrothermal Co-simulation

https://www.ansys.com/-/media/ansys/corporate/resourcelibrary/article/aa-v4-i1-predicting-circuit-board-hot-spots.pdf

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Thermal Solutions for 3-D IC, Packages and System

https://www.ansys.com/-/media/ansys/corporate/resourcelibrary/techbrief/tb-thermal-solutions-for-3d-ic-pkg-and-sys.pdf?la=en-gb&hash=B4665B512575383C351750E65E81FE6725AA2AF9

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